Special electrograde, zero temper, high tensile copper foil tape. Provides excellent solderability. Malleable copper foil conforms well to irregular contours. Its aggressive acrylic adhesive system creates a superior bond. Used for RFI/EMI shielding applications in the electrical/electronics industry. Typical Applications: EMI/RFI shielding of small electromagnetic components (i.e. transformer/reactor coils) and cable splices; repairing, modifying & prototype designing wiring boards, supplementary shielding of joints/seams; flat conductor assemblies.
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